中文版 English
Introduction
 
  Introduction
  Organization
  Members
  Research
  Outcomes
  Location
  Contact us
  Home

Center for Information and Electronics Technologies

    Today information and electronics is a new science that draws from sources such as mathematics, physics, chemistry and biology. In the past several decades, this new science has created innumerable new technologies which have completely changed our everyday life – from devices to chips, from computers to networks and cell phones, from education to entertainment to working environment, just to name a few. This is the frontiers of science and knowledge, and is where all major countries worldwide are making the best effort in promoting research programs in order to remain on the leading edge globally. This is definitely one of the few most important areas of science and technologies in the 21st century. The information and electronic industry is the largest and most important industry and the major core of economic development of Taiwan. The information and electronics industry is also where Taiwan plays a decisive role in the world. Certainly this area is extremely important to Taiwan.

   This is the second phase of the Center for Information and Electronics Technologies (CIET), with a goal of continuing the effort and great achievements of the first-phase program, while further teaming up the very strong faculty members and students of the Center and putting together a more focused research theme, with a hope to accomplish even better achievements in the next 5 years. This is implemented by vertically integrating 6 major research areas or subprojects (optoelectronics and components, integrated platform for intelligent sensing chips, millimeter-wave and system-in-package technologies, seamless connectivity, cloud computing, and intelligent medical care), with a research theme of “Broadband Sensing Cloud Computing and Its Applications”. The basic idea is that the components sense the message, integrated and processed by chips, with millimeter-wave and system-in-package technologies through seamless connectivity, and finally all information and solutions are accessible in the cloud, with medical care as one application example:

Sub-project 1: Opto-Electronic and Sensing Devices
Sub-project 2: Integrated Platform for Intelligent Sensing Chips
Sub-project 3: Millimeter-wave and System-in-Package Technologies
Sub-project 4: Seamless Connectivity
Sub-project 5: Media and Social Cloud Computing with Chinese Flavor
Sub-project 6: Intelligent Diagnostic and Therapeutic Care System

    The CIET will manage the whole program, in order to make sure that each sub-project is executed by a distinguished research team to carry out advanced and innovative research in its own area of expertise, while the six sub-projects can work in a cohesive way so the respective efforts can be properly integrated.